glue(Lens bonding) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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Camera Module Adhesive Catalog

Camera Module Adhesive Catalog

High-performance adhesive for camera modules

This catalog introduces electronics adhesives manufactured by H.B. Fuller. We offer a wide range of products suitable for the latest camera modules, including those for housing bonding, active alignment, die attach, and FPC reinforcement. Please make use of this for selecting products. 【Featured Products (Excerpt)】 - Low-temperature curing adhesives - UV curing adhesives - UV/thermal or UV/moisture dual curing adhesives - Underfill materials, etc. *For more details, please feel free to contact us.

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and elasticity with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating rubber-like flexibility, a 200% elongation rate, and resistance to reflow, suitable for use in extreme cold to high-temperature environments. Premium Flexibility and 200% extend epoxy for waterproof. We provide Direct contact information for Nichimori HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Features: Low outgassing, low-temperature curing, oil resistance, halogen-free. NIC BOND (Product Number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste this into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

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